High-density interconnect technology has changed the rules of printed circuit board design. Miniaturized BGAs, laser-drilled microvias, ultra-fine traces, and sequential lamination build-ups all demand more from the base materials than conventional FR-4 can reliably deliver. Thermal stability, resin flow behavior, copper foil profile, and dielectric constant become critical variables when a design moves from prototype…
Author: Henrik Vestergaard
Danish renewable-energy lawyer living in Santiago. Henrik writes plain-English primers on carbon markets, Chilean wine terroir, and retro synthwave production. He plays keytar at rooftop gigs and collects vintage postage stamps featuring wind turbines.